Lọc theo danh mục
  • Năm xuất bản
    Xem thêm
  • Lĩnh vực
liên kết website
Lượt truy cập
 Lượt truy cập :  30,442,373
  • Công bố khoa học và công nghệ Việt Nam

31.19

Hoá học

Ni tơ rát hóa nhiệt bậc nguyên tử của nhóm IV các chất bán dẫn tích hợp trên quy mô siêu lớn

Atomic-order thermal nitridation of group IV semiconductors for ultra-large-scale integration

Nanoscience and nanotechnology

2015

1

1-5

2043-6262

One of the main requirements for ultta-Iarge-scale integration (ULSI) is atomic-order control of process technology. the concept of atomically controlled processing for group IV semiconductors is based on atomic-order surface reaction control in Si-based CVD epitaxial growth. On the atomic-order surface nitridation of a few om-thick Ge/about 4 nm-thick Sio.5Geo.s/Si(100) by NH3, it is found that N atoms diffuse through nm-order thick Ge layer into Sio.sGeo.s/Si(100) substrate and form Si nitride, even at 500°C. By subsequent H2 heat treatment, although N atomic amount in Ge layer is reduced drastically, the reduction of the Si nitride is slight. It is suggested that N diffusion in Ge layer is suppressed by the formation of Si nitride and that Ge/atomic-order N layerISii_xGe)Si (100) heterostructure is formed. These results demonstrate the capability of CVD technology for atomically controlled nitridation of group IV semiconductors for ultta-large-scale integration.

TTKHCNQG, CLt 740